| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser machining device with which a machining time is shortened and in which the number of parts, costs and adjustment time are reduced. SOLUTION: A beam dumper 4 is arranged outside the optical path of a laser beam which is outputted from a laser oscillator 1 and introduced to a galvanoscanner 7, a marginal pulse control is performed to the beam damper 4 by an acoustooptical element control part 12 by using an acoustooptical element 3, thus the part which is targeted by the galvanoscanner 7 does not move and the machining time is shortened, and a part outside the optical path is irradiated with the marginal pulse before the laser beam arrives at the galvanoscanner 7, thus a work 9 is not damaged by an erroneous irradiation due to the beam light movement for irradiation of the marginal pulse, and a machining is stably performed.</p> |
