| 摘要 |
A cooling system for a module IC handler is provided. The cooling system includes an air jet for cooling heat generated from the module IC where the IC is tested. The cooling system includes a base plate, an air jet body mounted on the base plate and having one or more coupling portions, a plurality of plates provided at one side of the air jet body, and a cover provided at the other side of the air jet body. Since the cooling system rapidly cools the heated module IC, the number of module ICs that fail can be reduced, thus resulting in an improvement in the reliability of the products.
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