发明名称 Solid imaging device
摘要 A frame transfer-type solid imaging device is provided, which can be operated without reducing the transfer efficiency or the transfer charge quantity.A plurality of N-type regions 5 constituting photoelectric conversion regions and a plurality of P+-type regions 6 constituting channel stop regions are formed on a P-type silicon substrate 4, and a transparent electrode 1 is further formed through an insulating film 7 on the substrate 4. The thickness of the transparent electrode at a portion above the photoelectric conversion region is made thinner than the thickness of the other part of the transparent electrode 1, and an antireflection film 8 is formed above the photoelectric conversion region 2.
申请公布号 US6525356(B1) 申请公布日期 2003.02.25
申请号 US19990458697 申请日期 1999.12.13
申请人 NEC CORPORATION 发明人 MURAKAMI ICHIRO;NAKASHIBA YASUTAKA
分类号 H01L27/148;(IPC1-7):H01L31/062;H01L31/113;H01L31/020;H01L31/023 主分类号 H01L27/148
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