| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing system of wafers or the like, that has high versatility, stable and high productivity, and satisfying economic demands in a process, from wet treatment to supercritical drying when producing semiconductor wafers, liquid crystal substrates, or the like. SOLUTION: The facilities comprises at least one wet treatment apparatus 1, that accommodates wafers or the like at the inside and carries out wet treatment, such as development, film formation, etching, and cleaning, at least one supercritical dryer 2 that accommodates wafers and the like, on the inside and carries out supercritical drying, and a conveyance apparatus 3 that conveys wafers and the like between the wet treatment apparatus 1 and supercritical dryer 2, while the surface is in a wet state. The supercritical dryer 2 has a mechanism for rotating the wafers and the like in the inside.
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