| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inexpensively obtaining a lead frame for a BCC. SOLUTION: The method for obtaining a lead frame having a recess and a flat part in a plating area by a photometric process by using a material for the lead frame comprises as essential steps the steps of (1) providing a resist layer on a rear surface of the material for the lead frame, (2) exposing a first mask having a pattern for opening a part to be etched and a second mask for forming a region to be plated in alignment, (3) removing the resist layer not photosensed by a first development to obtain an etching mask, (4) etching the material for the exposed lead frame to form a recess shape, (5) removing the resist layer once photosensed by a second time development, and (6) plating at a desired site by using the plating mask. |
