发明名称 PLASMA TREATMENT METHOD AND PLASMA TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a plasma treatment method and a plasma treatment device in which the rate of the plasma treatment can be improved, the plasma treatment performance can be stably improved with excellent reproducibility, and the plasma treatment cost can be reduced. SOLUTION: In the plasma treatment method in which a work is disposed in a reaction vessel 140, high frequency powers 150-1 and 150-2 of at least two different frequencies are simultaneously supplied to one and the same high frequency electrode, plasma is formed by the high frequency power introduced in the reaction vessel 140 from the high frequency electrode, and a work is treated, the temperature of a transmission passage of the high frequency of at least two different frequencies is monitored, the high frequency powers are matched and adjusted so that the temperature change on the transmission passage becomes smooth making reference to the temperature, and the work is treated thereby.
申请公布号 JP2003049277(A) 申请公布日期 2003.02.21
申请号 JP20010237644 申请日期 2001.08.06
申请人 CANON INC 发明人 SHIRASAGO TOSHIYASU;NIINO HIROAKI;MURAYAMA HITOSHI;AOKI MAKOTO
分类号 C23C16/52;H01L21/205;(IPC1-7):C23C16/52 主分类号 C23C16/52
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