| 摘要 |
PROBLEM TO BE SOLVED: To simply, accurately and ultrasonically weld an electronic component module to a flexible circuit board. SOLUTION: A method for mounting the electronic component module comprises the steps of positioning a punch 1, having an anvil 4 and the electronic component module 6, obtained by cutting by a die 2 on a flexible circuit board 9 by the anvil 4, and then ultrasonically welding the module 6 to the substrate 9. |
