| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for treatment on semiconductor wafers, capable of surely reducing particles and metal contamination. SOLUTION: This apparatus comprises a pressure vessel 2, having an opening for inputting and outputting wafers 9 to and from a treatment chamber 5, a lid 4 for opening and closing the opening, a sealing member 4A for sealing the interface between the lid 4 and the pressure vessel 2 for keeping the pressure, and an isolation means 12 for isolating the treatment chamber 5 from the gas flow channel of the sealing member 4A side.
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