| 摘要 |
PROBLEM TO BE SOLVED: To provide an image display device for which an element density, such as pixel density is improved, connection reliability is improved by enlarging a via diameter for wiring without reducing a chip size more than needed, yield is improved, and the request specifications of alignment accuracy of a chip (or element) are reduced by increasing a chip (or element) area and facilitating handling of bonding or the like. SOLUTION: For the image display device, the chip 50 composed of an embedded a light-emitting element 11, such as a GaN-based semiconductor light- emitting element in resin is provided with external terminals 58 and 59 connected to the light-emitting element 11, and a drive control element 55, such as a transistor for pixels for drive control of the light emitting element 11, is connected to the external terminals 58 and 59 in a state of at least partially overlapping with the chip 50. |
