| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin laminate having high resolution, capable of diminishing defects in a resist pattern and failures such as chipping, breaking and short circuit in a circuit formed in an etching or plating step and less liable to generate residue on removal in a resist pattern removing step particularly after electroplating by a semi-additive process. SOLUTION: In the photosensitive resin laminate consisting of a support layer (A), a photosensitive resin layer (B) and, optionally, a protective layer (C), the number of metal-containing particles or their aggregates having >=10 μm diameter is <=10 per 9 cm<2> and the thickness of the photosensitive resin layer (B) is 5-30 μm. |
