IMPROVED METHOD AND APPARATUS FOR BI-DIRECTIONALLY POLISHING A WORKPIECE

摘要

A chemical mechanical polishing apparatus and method uses a portion of a polishing pad (130) that is disposed under tension between a supply spool (160) and a receive spool (162) such that it will not degrade, a single drive system that allows for efficient bi-directional linear motion, and a mechanism that provides tension to either the supply spool or the receive spool and the other spool being locked during processing. If a new section of the polishing pad is needed, the same motor (770) that provided the tension is used to advance the polishing pad a determined amount. Further, during processing, a feedback mechanism (fig 8) is used to ensure that the tension of the polishing pad is consistently maintained.