发明名称 TRENCH CAPACITOR AND METHOD FOR FABRICATING THE SAME
摘要 PURPOSE: A trench capacitor and a method for fabricating the same are provided to increase capacitance of the trench capacitor without increasing an area of the trench capacitor. CONSTITUTION: A stacked layer(205) is formed by depositing a plurality of silicon layers(204) and inserting a silicon germanium layer(202) between the silicon layers(204). A trench(212) is formed by patterning the stacked layer(205). A capacitor dielectric(214) is formed on an inner wall of the trench(212). A storage node electrode(216) is formed on the inner wall of the trench(212). The storage node electrode(216) is formed by filling up a conductive material into a region surrounded by the capacitor dielectric(214). A concavo-convex portion is formed on the inner wall of the trench(216) by etching selectivity of the silicon layer(204) and the silicon germanium layer(202).
申请公布号 KR20030014832(A) 申请公布日期 2003.02.20
申请号 KR20010048715 申请日期 2001.08.13
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BAE, GEUM JONG;KIM, SANG SU;LEE, HWA SEONG;LEE, JEONG IL;LEE, NAE IN
分类号 H01L27/108;(IPC1-7):H01L27/108 主分类号 H01L27/108
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