发明名称 |
Lead frame for semiconductor device and method of producing same |
摘要 |
A lead frame for a semiconductor device includes a sheet-like body and a Pd coating plated on the sheet-like body. The Pd coating includes Ni in an amount of not more than 2%. In another embodiment, the Pd coating includes Cu in an amount of not more than 0.12%. By virtue of limiting the amount of Ni or Cu to these particular levels, the solderability of the lead frame is remarkably enhanced.
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申请公布号 |
US6521358(B1) |
申请公布日期 |
2003.02.18 |
申请号 |
US19980153065 |
申请日期 |
1998.09.15 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TANAKA HISAHIRO;IKARI MASANORI |
分类号 |
C23C2/04;C23C28/02;C25D3/50;C25D3/56;C25D5/12;H01L23/495;(IPC1-7):B32B15/00 |
主分类号 |
C23C2/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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