发明名称 |
METAL FOIL WITH RESIN |
摘要 |
PROBLEM TO BE SOLVED: To provide a metal foil with a resin having excellent solder heat resistance and high-frequency characteristics. SOLUTION: The metal foil with the resin comprises a thermosetting resin composition containing 1 to 80% of a liquid crystalline resin having a mean particle size of 100μm or less and a metal foil. The liquid crystalline resin is preferably a total aromatic polyester.
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申请公布号 |
JP2003048272(A) |
申请公布日期 |
2003.02.18 |
申请号 |
JP20010240392 |
申请日期 |
2001.08.08 |
申请人 |
MITSUBISHI PAPER MILLS LTD |
发明人 |
TSUKUDA TAKAHIRO;HYODO KENJI |
分类号 |
B32B15/08;H05K1/03;(IPC1-7):B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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