发明名称 METAL FOIL WITH RESIN
摘要 PROBLEM TO BE SOLVED: To provide a metal foil with a resin having excellent solder heat resistance and high-frequency characteristics. SOLUTION: The metal foil with the resin comprises a thermosetting resin composition containing 1 to 80% of a liquid crystalline resin having a mean particle size of 100μm or less and a metal foil. The liquid crystalline resin is preferably a total aromatic polyester.
申请公布号 JP2003048272(A) 申请公布日期 2003.02.18
申请号 JP20010240392 申请日期 2001.08.08
申请人 MITSUBISHI PAPER MILLS LTD 发明人 TSUKUDA TAKAHIRO;HYODO KENJI
分类号 B32B15/08;H05K1/03;(IPC1-7):B32B15/08 主分类号 B32B15/08
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