| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead plate manufacturing method capable of easily manufacturing a lead plate with high accuracy. SOLUTION: A plate 3 is installed on a first die 2 so that a thin-walled part 4 and a thick-walled part 5 on one side are located above a punched hole 1, and a first punch 8 having a tip surface 12 away from the first die 2 as closer to one end is pressed into the punched hole 1, and stopped at the position where one end does not press the thick-walled part 5 therein. A base part is connected to the plate 3 to form a lead. Next, the plate 3 is installed on a second die, a second punch having a tip surface slightly larger in section than the first punch 8 and far from the second die as closer to one end is pressed into the punched hole, and stopped at the position where one end does not press the base part of the lead therein, and an edge of the plate 3 facing a circumferential edge of an oscillating part of the lead.</p> |
