Semiconductor device, method of manufacture thereof, circuit board, and electronic device

摘要

A semiconductor device has first and second substrates (10, 20) disposed so as to be overlaid, and a semiconductor chip (30) mounted on each of the first and second substrates (10, 20). A first interconnect pattern (12) formed on the first substrate (10) has bent portions (16) which project from the surface of the first substrate (10). The bent portions (16) are bonded to a flat portion (26) of a second interconnect pattern (22) formed on the second substrate (20).