| 摘要 |
PROBLEM TO BE SOLVED: To prevent an IC module from being damaged when external force is applied in the direction of bending a base material and also to suppress the IC module from peeling off from the base material. SOLUTION: In intermediate layers 22 and 23 constituting the base material 20 on which the IC module 10 where information can be written and read is mounted, a groove shape that surrounds the IC module is made of soft materials 22b and 23b softer than materials constituting the other areas. |
