| 摘要 |
PURPOSE: A method for manufacturing a wafer level package is provided to improve reliability and simplify manufacturing processes by maximizing the contact area of a metal wire to connect a conductive ball. CONSTITUTION: A plurality of chip pads are formed on a substrate(300). The first insulating layer(316) including the first aperture to expose the chip pads and the second aperture for forming a ball land, is formed on the substrate(300). A metal wire(318) is formed on the first insulating layer(316) to connect the chip pads via the first aperture and to have the ball land. The second insulating layer(320) having the third aperture to expose the ball land is formed on the metal wire(318). A conductive ball(330) is then mounted on the exposed ball land via the third aperture. |
