SEALING RESIN, RESIN-SEALED SEMICONDUCTOR AND SYSTEM-IN-PACKAGE

摘要

PURPOSE: A sealing resin, a resin-sealed semiconductor using the sealing resin and a system-in-package containing the semiconductor are provided, to improve the distribution of fillers on different spaces or gaps for sealing by resin molding. CONSTITUTION: The sealing resin(11) comprises a resin component(12); and a filler(13) which is mixed in the resin component and has a grain size distribution having a plurality of grain size peaks. Preferably the filler comprises a spherical filler and a crushed filler having the grain size peak. Preferably the spherical filler has a maximum grain distribution peak at about 1.8 micrometers and an inclination angle (n) of 0.8-1.4 in a Rosin-Rammler diagram; and the crushed filler has a maximum grain distribution peak at about 10 micrometers and an inclination angle (n) of 0.6-1.4 in a Rosin-Rammler diagram.