Centering device for automatic placement of chip components in hybrid circuits

摘要

A device for centering chip components attached to the tip of a pick and place spindle after selection from storage and prior to placement on a substrate. The need for precisely stored component chips is eliminated. A vacuum in the hollow spindle tip holds the component chip, while, in turn, cam-driven feet and fingers attached to the spindle housing push the component chip to a centered position on the spindle.