发明名称 |
ROTARY DISK GRINDING WHEEL |
摘要 |
PROBLEM TO BE SOLVED: To effectively reduce wear of a side surface of a segment chip while maintaining excellent cutting performance by improving the distribution of wear-resistant particles for forming a side wear-resistant surface of the segment chip. SOLUTION: Wear of a side surface of the segment chip can be unified, and the service life and the cutting capacity of a grinding wheel can be improved without any deviation of the cooling water flow and the chip flow by regularly disposing diamond abrasive grains 21 as wear-resistant particles having the grain size substantially the same as that of the abrasive grains on a side surface of the segment chip 12 of a rotary disk grinding wheel 10 with the segment chips 12 arranged at predetermined intervals via slits 13 and 14 on an outer circumferential surface of a substrate with the diffused surface distribution ratio in a range of 2-20% of the area of the segment chip side surface.
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申请公布号 |
JP2003039332(A) |
申请公布日期 |
2003.02.13 |
申请号 |
JP20010226549 |
申请日期 |
2001.07.26 |
申请人 |
NORITAKE SUPER ABRASIVE:KK;NORITAKE CO LTD |
发明人 |
OGATA SEIYA |
分类号 |
B24D3/02;B24D3/34;B24D5/12;B28D1/12;B28D1/24;(IPC1-7):B24D5/12 |
主分类号 |
B24D3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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