发明名称 |
Treatment of circuit support with impulse excitation |
摘要 |
The devices and methods of the art do not readily allow moistening of, removing gas bubbles from and/or increasing the transfer of material in through bores and/or pocket holes in printed circuit boards (PCB). Considerable problems are presented by the treatment of very narrow bores with high aspect ratios in particular. To overcome this problem a method was found that involves the following stages: the printed circuit boards PCB are passed through a processing plant on a horizontal conveying path and in one conveying plane 2 by means of transportation means 13, 14 and are thereby brought to contact a liquid for treatment, wherein mechanical pulses are directly transmitted to the printed circuit boards PCB via the transportation means 13, 14 and/or via the liquid for treatment by means of pulse generating means 50.
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申请公布号 |
US2003029717(A1) |
申请公布日期 |
2003.02.13 |
申请号 |
US20020221235 |
申请日期 |
2002.09.10 |
申请人 |
SCHRODER ROLF;DE BOER REINHARD;GRAPENTIN HANS-JOACHIM;CZECZKA REGINA |
发明人 |
SCHRODER ROLF;DE BOER REINHARD;GRAPENTIN HANS-JOACHIM;CZECZKA REGINA |
分类号 |
C25D7/00;C25D7/06;C25D21/04;H05K3/00;H05K3/18;H05K3/26;(IPC1-7):C25D1/00 |
主分类号 |
C25D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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