发明名称 CONTINUOUS TRANSPORT BARREL PLATING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a continuous-transport barrel plating equipment, which automatically performs operations such as electrolytic plating of a chip component, or separation and cleaning of the chip component and the media, to reduce the human operations, improves quality of a plated film, and can shorten the treatment time. SOLUTION: This continuous-transport barrel plating equipment comprises barrel plating parts 1, 2, and 3 which use a barrel unit 5; a delivery part 20 for receiving the barrel unit 5 which has been barrel plated in the barrel plating parts 1, 2, and 3, taking out the chip components and the media from the barrel unit 5, and transporting them into a cleaning pot 30 which passes the media, but not the chip component; and a separating and cleaning part 25 for receiving the pot 30 from the above delivery part 20, separating the media by spraying cleaning liquid to the pot 30 and dropping off the media from the pot 30, and cleaning the chip component.
申请公布号 JP2003041399(A) 申请公布日期 2003.02.13
申请号 JP20020070093 申请日期 2002.03.14
申请人 TDK CORP 发明人 MORI KANEO;KONNO TADAYOSHI;ONODERA AKIRA;SAKURAI TAKASHI;KUDO JUN;KONNO MASAHIKO
分类号 C25D17/16;C25D17/12;C25D17/20;C25D21/00;C25D21/08;(IPC1-7):C25D17/16 主分类号 C25D17/16
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