| 摘要 |
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition excellent in roughness, etching resistance, sensitivity and resolution and capable of stably forming a fine pattern with a high degree of accuracy. SOLUTION: The radiation sensitive resin composition contains a radiation sensitive acid generator such as 2,4,6-trimethylphenyldiphenylsulfonium 2,4- difluorobenzenesulfonate or bis(4-t-butylphenyl)iodonium 2,4- difluorobenzenesulfonate, an alkali-insoluble or slightly alkali-soluble resin having units obtained by cleaving the polymerizable unsaturated bonds of o- hydroxystyrene, m-hydroxystyrene or the like and a compound prepared by substituting a monovalent acid dissociable group for the hydrogen atom of the hydroxy group of the above compound and a dissolution accelerator having a unit obtained by cleaving the polymerizable unsaturated bond of o- hydroxystyrene, m-hydroxystyrene or the like. |
