| 摘要 |
A solution capable of removing adherent organic material from the surface of a solid substrate at room temperature is disclosed. The solution includes a first solvent, preferably water, having dissolved therein: up to 2% alkali metal silicates, a source of alkalinity that is substantially free of alkali metal hydroxide ions, at least one organic solvent, and an amount of hydrotrope effective to render the organic solvent or solvents soluble in the solution, an amino alcohol may be included, at least one surfactant, and a corrosion inhibitor may be included. The solution should have an alkaline pH less than about 12. The solution is used to remove the adherent organic material by soaking the object having such material thereon in such a solution, preferably at room temperature. |
