Production of a hermetic encapsulation comprises fixing and electrically contacting a component formed on chip on a support, covering the rear side of the chip with a plastic film, connecting with the support, structuring, etc.

摘要

Producing a hermetic encapsulation comprises fixing and electrically contacting a component formed on chip (1) on a support (4) having electrical connecting surfaces (7) so the component structures direct the front side of the chip to the support; covering the rear side of the chip with a plastic film (8) so the edges of the film overlap the chip; connecting the film with the support in the whole edge region around the chip in a sealed way; structuring the film so that it is partially removed outside of the edge region; and applying a hermetically sealed layer (14) over the film. The sealing layer hermetically seals with the support in a contact region outside of the edge region. Preferred Features: The film is a thermoplastic film which overlaps the chip and is laminated on the chip rear side and the support under pressure and elevated temperature. A base metallization is applied on the film and the surrounding surface of the support.