发明名称 |
IT LAMINATING DOUBLE-SIDE CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR AND MULTI-LAYER PRINTED CIRCUIT BOARD USING |
摘要 |
<p>The present invention comprises a plurality of laminating double-side circuit boards and a plurality sheets of prepreg for interlayer connection that are placed one on another. Via holes extend from the circuit on one side of each laminating double-side circuit board to the circuit on the other side thereof. Each via hole is filled with electro-conductive material to connect the circuits on both sides of the laminating double-side circuit board. The pad on a laminating double-side circuit board and the pad on another laminating double-side circuit board are laminated via a sheet of prepreg for interlayer connection so that the respective pads are opposed to each other via the through hole filled with electro-conductive material formed through the sheet of prepreg for interlayer connection. Thereby, the respective pads on the laminating double-side wiring circuit boards are electrically connected with one another. Thus, the present invention can provide a multilayer printed wiring board having shorter production time, excellent reliability, and high yield. <IMAGE></p> |
申请公布号 |
EP1283662(A1) |
申请公布日期 |
2003.02.12 |
申请号 |
EP20020710365 |
申请日期 |
2002.01.29 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TAKASE, YOSHIHISA;NAKAMURA, TSUNESHI |
分类号 |
H05K3/40;H05K3/00;H05K3/38;H05K3/42;H05K3/46;(IPC1-7):H05K1/11 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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