发明名称 |
COOLING APPARATUS WITH POROUS MEDIUM |
摘要 |
PURPOSE: A micro cooling apparatus with porous medium is provided to improve cooling efficiency for chips with relatively higher calorification. CONSTITUTION: A micro cooling apparatus(100) includes a base plate(102) having a heat source contacting with a part of a bottom thereof; porous medium(40) placed on a part of an outside of the base plate corresponding with the heat source to supply refrigerant for cooling the heat source and having distribution of pores to generate capillary action from the outside to the part; and a condensing device condensing steam generated during cooling the heat source to supply to the porous medium.
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申请公布号 |
KR20030012148(A) |
申请公布日期 |
2003.02.12 |
申请号 |
KR20010046037 |
申请日期 |
2001.07.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KO, JEONG SANG;LEE, YONG SU |
分类号 |
F28D17/02;(IPC1-7):F28D17/02 |
主分类号 |
F28D17/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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