发明名称 COOLING APPARATUS WITH POROUS MEDIUM
摘要 PURPOSE: A micro cooling apparatus with porous medium is provided to improve cooling efficiency for chips with relatively higher calorification. CONSTITUTION: A micro cooling apparatus(100) includes a base plate(102) having a heat source contacting with a part of a bottom thereof; porous medium(40) placed on a part of an outside of the base plate corresponding with the heat source to supply refrigerant for cooling the heat source and having distribution of pores to generate capillary action from the outside to the part; and a condensing device condensing steam generated during cooling the heat source to supply to the porous medium.
申请公布号 KR20030012148(A) 申请公布日期 2003.02.12
申请号 KR20010046037 申请日期 2001.07.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KO, JEONG SANG;LEE, YONG SU
分类号 F28D17/02;(IPC1-7):F28D17/02 主分类号 F28D17/02
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