发明名称 |
Wafer holding plate for wafer grinding apparatus and method for manufacturing the same |
摘要 |
<p>A wafer holding plate for a wafer grinding apparatus. The plate includes a substrate (B1) having a wafer adhering surface (6a) to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern (10), which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.</p> |
申请公布号 |
EP1283089(A2) |
申请公布日期 |
2003.02.12 |
申请号 |
EP20020021015 |
申请日期 |
2000.03.21 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
JIMBO, NAOYUKI;OKUDA, YUJI;ISHIKAWA, SHIGEHARU;MISHIMA, ATSUSHI |
分类号 |
B24B1/00;B24B7/22;B24B37/30;B24C1/04;B24C3/32;H01L21/463;(IPC1-7):B24B37/04;B24B41/06 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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