发明名称 LEAD FRAME AND METHOD FOR FABRICATING THE SAME
摘要 PURPOSE: A lead frame and a method for fabricating the same are provided to prevent injection of EMC(Epoxy Molding Compound) and the generation of flash in a molding process by forming a projection at a position for forming a swaging. CONSTITUTION: A plate-shaped portion(1a) has a hole(2) of a predetermined size, a swaging(3) of a predetermined size, and a projection. The hole(2) is formed on a lead frame(1). The swaging(3) is formed at a lower side of the hole(2). The projection is formed on an outer circumference of the swaging(3). A comb-shaped portion(1b) has a plurality of lead legs. A diameter of the swaging(3) is larger than a diameter of the hole(2) of the plate-shaped portion(1a).
申请公布号 KR20030012293(A) 申请公布日期 2003.02.12
申请号 KR20010046267 申请日期 2001.07.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, SANG GUK;SIM, BO GEUN
分类号 H01L23/495;(IPC1-7):H01L23/495 主分类号 H01L23/495
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