发明名称 |
LEAD FRAME AND METHOD FOR FABRICATING THE SAME |
摘要 |
PURPOSE: A lead frame and a method for fabricating the same are provided to prevent injection of EMC(Epoxy Molding Compound) and the generation of flash in a molding process by forming a projection at a position for forming a swaging. CONSTITUTION: A plate-shaped portion(1a) has a hole(2) of a predetermined size, a swaging(3) of a predetermined size, and a projection. The hole(2) is formed on a lead frame(1). The swaging(3) is formed at a lower side of the hole(2). The projection is formed on an outer circumference of the swaging(3). A comb-shaped portion(1b) has a plurality of lead legs. A diameter of the swaging(3) is larger than a diameter of the hole(2) of the plate-shaped portion(1a).
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申请公布号 |
KR20030012293(A) |
申请公布日期 |
2003.02.12 |
申请号 |
KR20010046267 |
申请日期 |
2001.07.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, SANG GUK;SIM, BO GEUN |
分类号 |
H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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