METHOD FOR FABRICATING HIDDEN LASER VIA HOLE OF MULTI-LAYERED PCB

摘要

PURPOSE: A method for fabricating a hidden laser via hole of a multi-layered PCB(Printed Circuit Board) is provided to improve a bonding characteristic in a mounting process of an electronic component by widening a contact area between a laser via hole and the electronic component. CONSTITUTION: A multi-layered substrate is formed by laminating a plurality of layers. A laser via hole is processed by performing a laser drilling process. The first external conductor layer is formed by performing the first panel plating process on the substrate. A laser via(120) is formed by performing a plugging process with silver paste or copper paste or conductive filling agent. A polishing process for the laser via(120) is performed. The second external conductive layer is formed on the first external conductive layer and the laser via(120) by performing the second panel plating process on the substrate. A wiring pattern is formed on the second external conductive layer.