| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a semiconductor device. SOLUTION: The semiconductor device comprises a circuit pattern 23, having a plurality of packaging regions on its surface, a circuit element (a memory chip 27) fixed on the circuit pattern 23 corresponding to the packaging regions, an insulation resin 30 for sealing the circuit pattern 23 and the memory chip 27 and for exposing terminals 24. Using a plurality of semiconductor devices, the mounting area can be reduced by fixing and resin sealing mutual semiconductor devices with their terminals 24 exposed from the insulation resin 30 fixed each other to, constitute a memory card. |
