SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A semiconductor package is provided to rapidly radiate the heat of a semiconductor chip to the outside by forming a conductive frame and a conductive via made of copper or aluminum having a good heat radiation capacity. CONSTITUTION: The conductive frame(10) of a plate type having upper and lower surfaces(10a,10b) of an almost plane is prepared. A plurality of penetration holes(10c) are arrayed in the conductive frame. The conductive via(12) surrounded by an insulator is formed in the penetration hole. An insulation layer(16) in which a communication hole(16a) is formed in a region corresponding to the conductive via is formed on the conductive frame. A plurality of circuit patterns(18) electrically connected to the conductive via through the communication hole are formed on the insulation layer of a substrate(100). A semiconductor chip(24) is attached to the center of the upper surface of the substrate. A plurality of input/output pads(24a) are formed on the semiconductor chip. A conductive wire(26) connects the input/output pads of the semiconductor chip with the circuit pattern. An encapsulation unit(28) protects the semiconductor chip on the substrate and the conductive wire from the environment. A plurality of conductive balls(30) are melted and attached to the lower surface of the conductive via of the substrate.