METHOD AND APPARATUS FOR CUTTING SUBSTRATE USING LASER IRRADIATION

摘要

PROBLEM TO BE SOLVED: To provide a method and an apparatus for cutting a substrate by using laser irradiation. SOLUTION: The method for cutting the substrate by using the laser irradiation comprises a step of scanning a laser beam on the substrate, a step of removing a first layer of the substrate by the laser beam, and the steps of thereafter refocusing the beam on a newly exposed second layer and passing the beam therethrough. The steps are repeated until a separation is completed. This method and the apparatus are particularly suitable for a singularization of an integrated circuit package.