发明名称 APPARATUS AND METHOD FOR TREATING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an apparatus and a method for treating a substrate capable of treating a surface of the substrate with ozone water uniformly on the surface of the substrate. SOLUTION: The apparatus for treating the substrate treats the Sa surface of the substrate S with the ozone water L. The apparatus comprises a holding means 1 for holding the substrate S, an ozone water nozzle 5 for supplying the ozone water L to the surface Sa of the substrate S held by the means 1, and ozone supply means 7, 9 for supplying ozone O3 to a downstream of an ozone water stream formed by supplying the water L from the nozzle 5 to the surface Sa of the substrate S held by the means 1.
申请公布号 JP2003037095(A) 申请公布日期 2003.02.07
申请号 JP20010223884 申请日期 2001.07.25
申请人 SONY CORP 发明人 OKAMOTO AKIRA
分类号 G02F1/13;B08B3/02;B08B3/08;H01L21/304;(IPC1-7):H01L21/304 主分类号 G02F1/13
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