RESIN FRAME FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a resin frame for semiconductor package used for manufacturing a semiconductor package, such as BGA, CSP. SOLUTION: The resin frame for semiconductor package has a plurality sets of wiring patterns 6 on one side of a prescribed region, where the semiconductor package is manufactured with its both sides except prescribed region formed by respectively desired metal reinforced patterns 7 and 8, and an unpierced concave section 9 is formed, extending from the opposite side of the plurality sets of the wiring patterns 6 to the backside of the wiring pattern. Therefore, the semiconductor package, capable of meeting requirements of downsizing and high density, can be manufactured stably.