| 摘要 |
PROBLEM TO BE SOLVED: To prevent a wide area of a substrate, which is a drawback of a surface mounting electronic component, in which a substrate mounted with a various types of circuit components is soldered and fixed on a mold base, having a lead terminals and grounding terminals projected from its top surface. SOLUTION: Lead terminals 35 and a grounding terminal 36 are arranged, so that the top 35a and 36a of the terminals 35 and 36 are respectively laid to be flat on the top surface of a mold base 31. Terminals 56 and 57 of the surface side, the terminals being positioned, so as to correspond to the respective tops of the terminals 35 and 36, are provided on the bottom face of a substrate 50. The respective tops of the terminals 35 and 36 are connected to the respective terminals 56 and 57 through soldering. |
