发明名称 HIGH-PERFORMANCE HEAT SINK FOR COOLING ELECTRONICS
摘要 PROBLEM TO BE SOLVED: To provide a heat sink for attaining a surface, having a very high convection heat transfer characteristic per unit volume. SOLUTION: The heat sink comprises a diffused plate 30, having a recessed region on a certain surface and a flat region on the other surfaces, at least two fins 32, and a porous net-like foamed block 34, having interposed gaps 36 for partly filling a width and a length between the fins. The foamed block may be a single block which continues in a space between the two adjacent fins along a longitudinal direction of the fin or may be an array of short blocks, having the interposed gap along the longitudinal direction of the fin.
申请公布号 JP2003037226(A) 申请公布日期 2003.02.07
申请号 JP20020136548 申请日期 2002.05.13
申请人 DELPHI TECHNOLOGIES INC 发明人 BHATTI MOHINDER SINGH;JOSHI SHRIKANT M;JOHNSON RUSSELL S
分类号 F25D1/00;F28F3/02;F28F13/00;H01L23/36;H01L23/367;H01L23/373;H05K7/20;(IPC1-7):H01L23/36 主分类号 F25D1/00
代理机构 代理人
主权项
地址