MULTI-LAYER CIRCUIT TAPE, FABRICATING METHOD THEREOF AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A multi-layer circuit tape is provided to design more circuit patterns in circuit tape and easily form a plurality of input/output pads for power and ground in a semiconductor chip by forming a two-layer circuit pattern. CONSTITUTION: A plurality of through holes(4) are arrayed in the first insulation layer(2) of an almost plate type. A plurality of the first circuit patterns(6) are formed on the first insulation layer, exposed to the downward direction through the through hole. The second insulation layer(8) is formed on the entire surface of the first circuit pattern except a predetermined region of the first circuit pattern. The second circuit pattern(12) is formed on the second insulation layer, electrically connected to the first circuit pattern.