发明名称 HIGH SOUND INSULATION FLOOR STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a high sound insulation floor structure for achieving excellent sound insulation performance while lowering a a floor panel, bringing the end edges of adjacent floor panels to be arranged without any gap, into mutual contact with each other increasing support rigidity of the floor panel, compact in the structure and superior in cost reduction. SOLUTION: A lower end of a vibration insulation support member 14 if fixed on a receiving fitting 12 provided on the side of an H beam or I section making a floor beam 11, a cross sectional substantially C-shaped panel support member 14 fixed on the upper end of the vibration insulation support member 14 is arranged so as to sandwich an upper side flange part 11a or the H beam or the I section being the floor beam 11 between an upper side projection piece 14a and a lower side projection piece 14b making the C shape, and a deflection clearance of a vibration insulation support member 13 is left between the upper side projection piece 14a and the upper side flange part 11a. The end edge parts of the adjacent floor panels 15 are brought into contacted with the panel support member 14.
申请公布号 JP2003035003(A) 申请公布日期 2003.02.07
申请号 JP20010225362 申请日期 2001.07.26
申请人 TOKAI RUBBER IND LTD 发明人 UCHIYAMA TAKASHI
分类号 E04B1/82;E04B5/43;(IPC1-7):E04B5/43 主分类号 E04B1/82
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