| 摘要 |
PROBLEM TO BE SOLVED: To visually inspect existence or non-existence of wrong parts and the like, which are arranged inside a socket, in the state wherein the socket for electronic component is attached in the substrate which has been equipped with the electronic component. SOLUTION: The IC socket 1 has been attached in the substrate and accepts and holds an IC tip 50 with two or more lead terminals 52, which project in its lower direction from its main part 51. The IC socket 1 has the transparent or translucent socket main part 10 and two or more contacts 20 which are arranged with prolonging to up and down directions in the socket main part 10. Each contact 20 is constituted of a lead acceptance part 21 arranged in arranging space 12 of the socket main part, and a connection leg 23, which projects in a lower direction from the socket main part 10. By inserting the lead terminal 52 into the lead acceptance part 21 from an upper surface opening 12a of the socket main part, the IC tip 50 is attached in the upper surface side of the socket main part 10.
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