Electronic component used in flip-chip technology, comprises a semiconductor chip having contact surfaces on its active surface connected to contact connecting surfaces of a wiring plate via an anisotropic soldering adhesive

摘要

Electronic component comprises a semiconductor chip (2) having contact surfaces (4) on its active surface (3). The contact surfaces are connected to contact connecting surfaces (5) of a wiring plate (6) via an anisotropic soldering adhesive (7). The plate has connecting contacts (8) for metallic surfaces in the tempered state. An Independent claim is also included for a process for the production of an electronic component. Preferred Features: The contact surfaces are arranged in a passivating layer (9) which protrudes over the contact surfaces on the active surface (3) of the chip. The wiring plate has an insulating carrier plate (10) which has a upper surface (11) for the contact connecting surfaces and a lower surface (12) for external contacts (13) of the component. The soldering adhesive has soldering particles made from a tin/bismuth alloy embedded in an epoxy resin adhesive.