发明名称 Semiconductor device with mushroom electrode and manufacture method thereof
摘要 A semiconductor device has: a semiconductor substrate having a pair of current input/output regions via which current flows; an insulating film formed on the semiconductor substrate and having a gate electrode opening; and a mushroom gate electrode structure formed on the semiconductor substrate via the gate electrode opening, the mushroom gate electrode structure having a stem and a head formed on the stem, the stem having a limited size on the semiconductor substrate along a current direction and having a forward taper shape upwardly and monotonically increasing the size along the current direction, the head having a size expanded stepwise along the current direction, and the stem contacting the semiconductor substrate in the gate electrode opening and riding the insulating film near at a position of at least one of opposite ends of the stem along the current direction.
申请公布号 US2003025208(A1) 申请公布日期 2003.02.06
申请号 US20020084924 申请日期 2002.03.01
申请人 FUJITSU LIMITED 发明人 MAKIYAMA KOZO;IKECHI NAOYA;TAN TAKAHIRO
分类号 H01L21/027;H01L21/28;H01L21/338;H01L29/417;H01L29/423;H01L29/43;H01L29/47;H01L29/49;H01L29/78;H01L29/812;H01L29/872;(IPC1-7):H01L21/44;H01L23/48 主分类号 H01L21/027
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