METHOD AND APPARATUS FOR PERFORMING FINAL CRITICAL DIMENSION CONTROL

摘要

The present invention provides for a method and an apparatus for control of final critical dimensions during processing of semiconductor wafers (105). A manufacturing run of semiconductor wafers (105) is processed. Metrology data from the processed semiconductor wafers (105) is acquired. A final critical dimension control adjustment process is performed using the acquired metrology data. A feedback/feed-forward modification process is performed in response to the final critical dimension control adjustment process.