| 摘要 |
An inexpensive surface acoustic wave apparatus uses a flip chip bonding technique and is capable of reducing an ohmic loss by reducing an electrode electrical resistance and also operates at a high-frequency range. A surface acoustic wave apparatus has a surface acoustic wave element bonded to a package by using a bonding flip chip technique. In the surface acoustic wave element, on a piezoelectric substrate, an IDT electrode, bus bar electrodes, reflector electrodes, relay electrodes, and electrode pads are disposed. Conductive films are disposed on the electrode pads and define a first metallic film, and the conductive films are also disposed on at least any of the bus bar electrodes and the relay electrodes to define a second metallic film.
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