Systems with high density packing of micromachines

摘要

Micromachine systems (100) are provided. An embodiment of such a micromachine system includes a substrate (111, 504) that defines a trench (116, 512). A first microelectromechanical device (110, 502) and a second microelectromechanical device (110, 502) are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided. <IMAGE>