| 摘要 |
PURPOSE: A low melting point glass excluding lead and alkali for electronic devices is provided, which has thermal, electrical and chemical stability and no pollution by containing Bi2O3 instead of Pb as a main component. CONSTITUTION: The low melting point glass(softening temperature: 420-480deg.C) comprises 60-75wt.% of Bi2O3, 7-15wt.% of B2O3, 5-7wt.% of SiO2, 1-18wt.% of P2O5, 1-3wt.% of Al2O3, 2-7wt.% of ZnO, 1-3wt.% of BaO and 0-2wt.% of TiO2. The resultant low melting point glass is applied to attachment of display panel, passivation, thick film circuit, ferrite magnetic head, etc.
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