发明名称 Flexible board
摘要 A flexible board comprises metal foil 1 and provided thereon a laminated polyimide-based resin layer 2 of a three-layer structure comprising a first polyimide-based resin layer 2a, a second polyimide-based resin layer 2b, and a third polyimide-based resin layer 2c, wherein the following equation is satisfied. <MATH> where k1 is the coefficient of linear thermal expansion of the first polyimide-based resin layer 2a on the side of the metal foil 1, k2 is the coefficient of linear thermal expansion of the second polyimide-based resin layer 2b, and k3 is the coefficient of linear thermal expansion of the third polyimide-based resin layer 2c. <IMAGE>
申请公布号 EP1014766(A3) 申请公布日期 2003.02.05
申请号 EP19990125418 申请日期 1999.12.20
申请人 SONY CHEMICALS CORPORATION 发明人 TAKAHASHI, SATOSHI;NAMIKI, HIDETSUGU
分类号 H05K1/02;B32B15/08;B32B15/088;H05K1/03 主分类号 H05K1/02
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