发明名称 SUBSTRATE HOUSING MOLDED CASE
摘要 PROBLEM TO BE SOLVED: To provide a substrate housing molded case that undergoes little deterioration of strength, being formed with a small number of parts for assembly thereof while maintaining a good appearance, capable of reducing the administrative cost therefor. SOLUTION: The molded case comprises a first molded case (1) and a second molded case (2) that is a reversed form of the first molded case (1) respectively having a base bottom part (10) and a peripheral uprising part (3) arising from along the periphery thereof. The first molded case (1) accommodates a base- board (3) in such a way that it is placed on the inner surface thereof, and thereafter the first molded case (1) and the second molded case (2) are coupled by butt-mating the opening of the second molded case (2) and the opening of the first molded case (1), thus housing the base-board (3) in such a manner as to sandwich it.
申请公布号 JP2003034326(A) 申请公布日期 2003.02.04
申请号 JP20010225807 申请日期 2001.07.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KAWAGUCHI KEI;UEDA ATSUNORI
分类号 B65D6/02;B65D85/86;(IPC1-7):B65D6/02 主分类号 B65D6/02
代理机构 代理人
主权项
地址