发明名称 |
SUBSTRATE HOUSING MOLDED CASE |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate housing molded case that undergoes little deterioration of strength, being formed with a small number of parts for assembly thereof while maintaining a good appearance, capable of reducing the administrative cost therefor. SOLUTION: The molded case comprises a first molded case (1) and a second molded case (2) that is a reversed form of the first molded case (1) respectively having a base bottom part (10) and a peripheral uprising part (3) arising from along the periphery thereof. The first molded case (1) accommodates a base- board (3) in such a way that it is placed on the inner surface thereof, and thereafter the first molded case (1) and the second molded case (2) are coupled by butt-mating the opening of the second molded case (2) and the opening of the first molded case (1), thus housing the base-board (3) in such a manner as to sandwich it.
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申请公布号 |
JP2003034326(A) |
申请公布日期 |
2003.02.04 |
申请号 |
JP20010225807 |
申请日期 |
2001.07.26 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
KAWAGUCHI KEI;UEDA ATSUNORI |
分类号 |
B65D6/02;B65D85/86;(IPC1-7):B65D6/02 |
主分类号 |
B65D6/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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