发明名称 Photomask, resist pattern formation method, method of determining alignment accuracy and method of fabricating semiconductor device
摘要 A photomask of this invention includes a main pattern part for forming a main pattern in a resist film and an alignment mark part for forming, in the resist film, an alignment accuracy determining mark not penetrating the resist film in section after development of the resist film.
申请公布号 US6514647(B1) 申请公布日期 2003.02.04
申请号 US20000615744 申请日期 2000.07.13
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HINOGAMI REIKO;WATANABE HISASHI;NAKAGAWA HIDEO
分类号 G03F1/00;G03F7/20;(IPC1-7):G03F9/00;G03C5/00 主分类号 G03F1/00
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